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INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
* The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications * The IC06 74HC/HCT/HCU/HCMOS Logic Package Information * The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC7014 Hex non-inverting precision Schmitt-trigger
Product specification Supersedes data of September 1993 File under Integrated Circuits, IC06 1998 Jul 08
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
FEATURES * Operating voltage 3 to 6 V * Output capability: standard * category: SSI APPLICATIONS * Wave and pulse shapers for highly noisy environments DESCRIPTION The 74HC7014 is a high-speed Si-gate CMOS device. It is specified in compliance with JEDEC standard no. 7A. The 74HC7014 provides six precision Schmitt-triggers with non-inverting buffers. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The precisely defined trigger levels are lying in a window between 0.55 x VCC and 0.65 x VCC. This makes the circuit suitable to operate in a highly noisy environment. Input shorts are allowed to -1.5 V and 16 V without disturbing other channels. FUNCTION TABLE INPUT nA L H Note 1. H = HIGH voltage level L = LOW voltage level OUTPUT nY L H 74HC7014N 74HC7014D ICC QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf = 6 ns SYMBOL VT+ VT- CI CPD PARAMETER positive going threshold negative going threshold input capacitance power dissipation capacitance per gate DC supply current notes 1 and 2 CONDITIONS
74HC7014
TYPICAL
UNIT V V pF pF
CL = 50 pF; VCC = 5 V 3.1 2.9 3.5 9
3.0
mA
Notes to the quick reference data 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz. fo = output frequency in MHz. CL = output load capacitance in pF. VCC = supply voltage in V. (CL x VCC2 x fo) = sum of outputs. 2. For HC the condition is VI = GND to VCC. ORDERING INFORMATION PACKAGE TYPE NUMBER PINS 14 14 PIN POSITION DIP SO MATERIAL plastic plastic CODE SOT27-1 SOT108-1
1998 Jul 08
2
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
PINNING PIN NO. 1, 3, 5, 9, 11, 13 2, 4, 6, 8, 10, 12 7 14 SYMBOL 1A to 6A 1Y to 6Y GND VCC data inputs data outputs ground (0 V) positive supply voltage NAME AND FUNCTION
74HC7014
Fig.1 Pin configuration.
Fig.2 Logic symbol.
Fig.3 IEC logic symbol.
Fig.5 Fig.4 Functional diagram.
Logic diagram (one Schmitt-trigger).
1998 Jul 08
3
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
DC CHARACTERISTICS FOR 74HC For the DC characteristics see "74HC/HCT/HCU/HCMOS Logic Family Specifications". Output capability: standard Category: SSI TRANSFER CHARACTERISTICS FOR 74HC Voltages are referenced to GND (ground = 0 V) Tamb (C) SYMBOL PARAMETER - - - - - 1.65 2.62 2.75 2.89 3.30 50 100 120 130 160 - II input leakage current - DC supply current - - - - 0.7 3.0 3.7 0.5 1.4 6.0 7.4 - - - - 5.0 1.8 7.5 10.0 - - - - 5.0 2.1 7.5 13.0 A +25 -40 to +85 - - - - - 1.65 2.62 2.75 2.89 3.30 50 100 120 130 160 0.1 - -40 to +125 MAX. 1.95 3.08 3.25 3.41 3.90 - - - - - - - - - - 1.0 - - - - - 1.65 2.62 2.75 2.89 3.30 50 100 120 130 160 1.0 - UNIT
74HC7014
TEST CONDITIONS VCC (V) 3.00 4.75 5.00 5.25 6.00 3.00 4.75 5.00 5.25 6.00 3.00 4.75 5.00 5.25 6.00 6.0 3.0 to 6.0 3.00 5.25 6.00 VCC or GND 16 V or GND VI (V) OTHER
MIN. TYP. MAX. MIN. MAX. MIN. 1.86 2.94 3.10 3.25 3.72 1.74 2.76 2.90 3.05 3.48 120 180 200 210 240 - 1.95 3.08 3.25 3.41 3.90 - - - - - - - - - - 1.95 3.08 3.25 3.41 3.90 - - - - - - - - - -
VT+
positive-going threshold
V
Figs.6 and 7
VT-
negative-going threshold
V
Figs.6 and 7
VH
hysteresis (VT+ - VT-)
mV
Figs.6 and 7
A
ICC
mA
1998 Jul 08
4
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
AC CHARACTERISTICS FOR 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF Tamb (C) SYMBOL PARAMETER MIN. tPHL propagation delay nA, nB to nY propagation delay nA, nB to nY output transition time - - - - - - - - - +25 TYP. 95 38 27 47 23 18 12 7 6 MAX. 475 115 73 175 52 46 20 15 13 -40 to +85 MIN. - - - - - - - - - MAX. 600 145 93 220 65 58 25 19 16 -40 to +125 MIN. - - - - - - - - - MAX. 715 175 112 260 78 70 30 22 19 ns UNIT
74HC7014
TEST CONDITIONS VCC (V) 3.00 4.75 6.00 3.00 4.75 6.00 3.00 4.75 6.00 WAVEFORMS
Fig.8
tPLH
ns
Fig.8
tTHL/tTLH
ns
Fig.8
TRANSFER CHARACTERISTIC WAVEFORMS
Fig.6 Transfer characteristic.
Fig.7
Waveforms showing the definition of VT+, VT- and VH.
AC WAVEFORMS
(1)
VM = 50%; VI = GND to VCC.
Fig.8 Waveforms showing the input (nA) to output (nY) propagation delay and the output transition times.
1998 Jul 08
5
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
PACKAGE OUTLINES DIP14: plastic dual in-line package; 14 leads (300 mil)
74HC7014
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH wM (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
1998 Jul 08
6
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
74HC7014
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06S JEDEC MS-012AB EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
1998 Jul 08
7
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
74HC7014
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Jul 08
8
Philips Semiconductors
Product specification
Hex non-inverting precision Schmitt-trigger
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
74HC7014
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Jul 08
9

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